Projects per year
Personal profile
Personal profile
Dr Tianhong Gu is presently an Assistant Professor in Materials Science and Engineering, the Department of Civil Engineering at Xian Jiaotong-Liverpool University (XJTLU). Previously she pursued material research in the UK as a Research Associate (2018-2021) at Imperial College London and a Research Fellow (2021-2022) at the University of Birmingham, with a focus on material microstructure control design, in-situ micromechanical testing microstructural characterisation and materials modelling to develop cross-disciplinary solutions for the next generation high-performance and substantial-reliability engineering materials in aerospace, automotive, electronics and nuclear applications. She is a specialist in understanding micromechanical deformation and microstructure, as well as in-situ microscope methods and analysis. Dr Gu graduated with M.Phil. in Materials Science and Metallurgy from University of Cambridge in 2014 and obtained a Ph.D. in Materials Science and Engineering from Imperial College London in 2018.Please get in touch if your research interests align with materials engineering, materials characterisation modelling. I accept applications from PhD students. For further details about PhD opportunities, please contact me.
Research interests
Industrial applications in microelectronics (electronic interconnection), nuclear energy, aerospace and automotive
Mechanical behaviour and failure mechanism of engineering alloys
Advanced materials characterisation (In-situ microscope and analysis)
Micromechanics and materials modelling
Experience
Assistant Professor, Department of Civil engineering, Xi’an Jiaotong-Liverpool University, present
Research Fellow, School of Metallurgy and Materials, University of Birmingham, 2021-2022
Research Associate, Department of Materials, Imperial College London, 2018-2021
Teaching
CEN425 Experimental Methods in Materials Mechanics (MRes / MSc module)
CEN412 Characterization of Materials (MRes module)
CEN102 / IND106 Fluid Mechanics and Thermodynamics (BEng module)
CEN425 Experimental Methods in Materials Mechanics (MRes / MSc module)
CEN412 Characterization of Materials (MRes module)
Education/Academic qualification
Ph.D. in Materials Science and Engineering, Imperial College London, UK - 2018
M.Phil. in Materials Science and Metallurgy (Downing College), University of Cambridge, UK - 2014
Person Types
- Staff
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Collaborations and top research areas from the last five years
Projects
- 1 Active
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Green Electronic Interconnections: Optimal Design for Lead-free Solders
1/07/23 → 30/06/26
Project: Internal Research Project
Research output
- 8 Article
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Multi-scale plasticity homogenization of Sn–3Ag-0.5Cu: From β-Sn micropillars to polycrystals with intermetallics
Xu, Y., Gu, T., Xian, J., Giuliani, F., Ben Britton, T., Gourlay, C. M. & Dunne, F. P. E., 10 Oct 2022, In: Materials Science and Engineering: A. 855, 143876.Research output: Contribution to journal › Article › peer-review
Open Access2 Citations (Scopus) -
Multi-scale plasticity homogenization of Sn–3Ag-0.5Cu: From β-Sn micropillars to polycrystals with intermetallics
Gu, T., Xu, Y., Xian, J., Giuliani, F., Britton, B., Gourlay, C. & Dunne, F., 2022, In: Multi-scale plasticity homogenization of Sn–3Ag-0.5Cu: From β-Sn micropillars to polycrystals with intermetallics.Research output: Contribution to journal › Article › peer-review
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Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder
Xu, Y., Gu, T., Xian, J., Giuliani, F., Ben Britton, T., Gourlay, C. M. & Dunne, F. P. E., 2021, In: International Journal of Plasticity. 137, 102904.Research output: Contribution to journal › Article › peer-review
21 Citations (Scopus) -
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
Gu, T., Gourlay, C. M. & Britton, T. B., Mar 2021, In: Journal of Electronic Materials. 50, 3, p. 926-938 13 p.Research output: Contribution to journal › Article › peer-review
Open Access10 Citations (Scopus) -
In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
Gu, T., Xu, Y., Gourlay, C. M. & Britton, T. B., 15 Jan 2020, In: Scripta Materialia. 175, p. 55-60 6 p.Research output: Contribution to journal › Article › peer-review
20 Citations (Scopus)