Projects per year
Personal profile
Personal profile
Dr Tianhong Gu is presently an Assistant Professor in Materials Science and Engineering, the Department of Civil Engineering at Xian Jiaotong-Liverpool University (XJTLU). Previously she pursued material research in the UK as a Research Associate at Imperial College London and a Research Fellow at the University of Birmingham, with a focus on material microstructure control design, in-situ micromechanical testing microstructural characterisation and materials modelling to develop cross-disciplinary solutions for the next generation high-performance and substantial-reliability engineering materials in aerospace, automotive, electronics and nuclear applications. She is a specialist in understanding micromechanical deformation and microstructure, as well as in-situ microscope methods and analysis. Dr Gu graduated with a MPhil in Materials Science and Metallurgy from the University of Cambridge and obtained a PhD in Materials Science and Engineering from Imperial College London.
Please get in touch if your research interests align with materials engineering, materials characterisation and modelling. I accept applications from PhD students. For further details about PhD opportunities, please contact me.
Research interests
Microelectronics (solder alloys); nuclear, aerospace and automotive (superalloys)
Mechanical behaviour and failure mechanism of engineering alloys
Advanced materials characterisation (In-situ microscope and analysis)
Micromechanics and materials modelling
Experience
Assistant Professor, Department of Civil engineering, Xi’an Jiaotong-Liverpool University, present
Research Fellow, School of Metallurgy and Materials, University of Birmingham, 2021-2022
Research Associate, Department of Materials, Imperial College London, 2018-2021
Teaching
CEN425 / CHE425 Experimental Methods in Materials Mechanics (MRes module)
CEN412 Characterization of Materials (MRes module)
CEN102 / IND106 Fluid Mechanics and Thermodynamics (BEng module)
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Education/Academic qualification
Fellow of the Higher Education Academy
Award Date: 4 Sept 2024
PhD, Materials Science and Engineering, Imperial College London
Award Date: 1 Mar 2019
Master, Materials Science and Metallurgy, University of Cambridge
Award Date: 25 Oct 2014
Person Types
- Staff
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Collaborations and top research areas from the last five years
Projects
- 3 Active
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Exploring engineering resilience of Tungsten (W)-based superalloys in extreme environments
1/03/24 → 28/02/27
Project: Internal Research Project
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Green Electronic Interconnections: Optimal Design for Lead-free Solders
1/07/23 → 30/06/26
Project: Internal Research Project
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Tensile Properties, Strain Rate Sensitivity and Microstructural Analysis of SN100C Solder Alloys
Gu, T., Jiang, S. & Su, W., 30 Jun 2024, Materials Science Forum: https://doi.org/10.4028/v-Q0ToJX. Vol. 1133.Research output: Chapter in Book or Report/Conference proceeding › Conference Proceeding › peer-review
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Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders
Gu, T., Xu, Y., Gourlay, C. M., Dunne, F. P. E. & Ben Britton, T., Dec 2024, In: Materials Science and Engineering A. 918, 147429Research output: Contribution to journal › Article › peer-review
Open Access1 Citation (Scopus) -
Multi-scale plasticity homogenization of Sn–3Ag-0.5Cu: From β-Sn micropillars to polycrystals with intermetallics
Gu, T., Xu, Y., Xian, J., Giuliani, F., Britton, B., Gourlay, C. & Dunne, F., 10 Oct 2022, In: Materials Science and Engineering: A. 855, 143876.Research output: Contribution to journal › Article › peer-review
Open Access7 Citations (Scopus) -
Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder
Xu, Y., Gu, T., Xian, J., Giuliani, F., Ben Britton, T., Gourlay, C. M. & Dunne, F. P. E., 2021, In: International Journal of Plasticity. 137, 102904.Research output: Contribution to journal › Article › peer-review
31 Citations (Scopus) -
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
Gu, T., Gourlay, C. M. & Britton, T. B., Mar 2021, In: Journal of Electronic Materials. 50, 3, p. 926-938 13 p.Research output: Contribution to journal › Article › peer-review
Open Access14 Citations (Scopus)