Green Electronic Interconnections: Optimal Design for Lead-free Solders

Project: Internal Research Project

Project Details

Project Title (In Chinese)

绿色电子互连:无铅焊料的优化设计

Fund Amount (RMB)

100000.00
Project CategoryRDF
StatusActive
Effective start/end date1/07/2330/06/26

Fingerprint

Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.