Tensile Properties, Strain Rate Sensitivity and Microstructural Analysis of SN100C Solder Alloys

Research output: Chapter in Book or Report/Conference proceeding › Conference Proceeding › peer-review

Cite this

@inproceedings{18dfd514a1f84235bb906563fcb4b7fd,

title = "Tensile Properties, Strain Rate Sensitivity and Microstructural Analysis of SN100C Solder Alloys",

author = "Tianhong Gu and Shuwei Jiang and Wen Su",

year = "2024",

month = jun,

day = "30",

language = "English",

isbn = "0255-5476",

volume = "ICMSN 2024",

booktitle = "Materials Science Forum",

}