TY - JOUR
T1 - Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder
AU - Xu, Yilun
AU - Gu, Tianhong
AU - Xian, Jingwei
AU - Giuliani, Finn
AU - Ben Britton, T.
AU - Gourlay, Christopher M.
AU - Dunne, Fionn P.E.
N1 - Funding Information:
All authors acknowledge the financial support by the Engineering and Physical Sciences Research Council for funding through the grant EP/R018863/1 . FPED wishes to acknowledge gratefully the provision of Royal Academy of Engineering / Rolls-Royce research chai funding . TBB wishes to acknowledge the Royal Academy of Engineering for funding his research fellowship.
Publisher Copyright:
© 2021 Elsevier Ltd. All rights reserved.
PY - 2021
Y1 - 2021
N2 - The creep behaviour of directionally solidified SAC305 (96.5Sn-3Ag-0.5Cu wt%) alloy has been investigated with integrated particle matrix composite (PMC) crystal plasticity modelling and quantitative experimental characterisation and test. In this manuscript, the mechanistic basis of creep rate dependence is shown to be influenced by plastic strain gradients, and the associated hardening due to geometrically necessary dislocation (GND) density. These gradients are created due to heterogenous deformation at the β-Sn phase and intermetallic compound (IMCs) boundaries. The size and distribution of IMCs is important, as finer and well dispersed IMCs leading to higher creep resistance and lower creep rates, and this agrees with experimental observations. This understanding has enabled the creation of a new microstructurally homogenised model which captures this mechanistic link between the GND hardening, the intermetallic size, and the corresponding creep rate. The homogenised model relates creep rates to the microstructure found within the solder alloy as they evolve in service, when ageing and coarsening kinetics are known.
AB - The creep behaviour of directionally solidified SAC305 (96.5Sn-3Ag-0.5Cu wt%) alloy has been investigated with integrated particle matrix composite (PMC) crystal plasticity modelling and quantitative experimental characterisation and test. In this manuscript, the mechanistic basis of creep rate dependence is shown to be influenced by plastic strain gradients, and the associated hardening due to geometrically necessary dislocation (GND) density. These gradients are created due to heterogenous deformation at the β-Sn phase and intermetallic compound (IMCs) boundaries. The size and distribution of IMCs is important, as finer and well dispersed IMCs leading to higher creep resistance and lower creep rates, and this agrees with experimental observations. This understanding has enabled the creation of a new microstructurally homogenised model which captures this mechanistic link between the GND hardening, the intermetallic size, and the corresponding creep rate. The homogenised model relates creep rates to the microstructure found within the solder alloy as they evolve in service, when ageing and coarsening kinetics are known.
KW - Creep
KW - Crystal plasticity
KW - Intermetallic
KW - Size effect
UR - http://www.scopus.com/inward/record.url?scp=85100899192&partnerID=8YFLogxK
U2 - 10.1016/j.ijplas.2020.102904
DO - 10.1016/j.ijplas.2020.102904
M3 - Article
AN - SCOPUS:85100899192
SN - 0749-6419
VL - 137
JO - International Journal of Plasticity
JF - International Journal of Plasticity
M1 - 102904
ER -