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Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder
Yilun Xu*, Tianhong Gu, Jingwei Xian, Finn Giuliani, T. Ben Britton, Christopher M. Gourlay, Fionn P.E. Dunne
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
22
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(Scopus)