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In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
Tianhong Gu*, Yilun Xu, Christopher M. Gourlay, T. Ben Britton
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
22
Citations
(Scopus)