In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint

Tianhong Gu*, Yilun Xu, Christopher M. Gourlay, T. Ben Britton

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)

Abstract

The heterogeneous evolution of microstructure in a single grain Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EBSD). Local deformation due to thermal expansion mismatch results in heterogeneous lattice rotation within the joint, localised towards the corners. This deformation is induced by the constraint and the coefficient of thermal expansion (CTE) mismatch between the β-Sn, Cu6Sn5 and Cu at interfaces. The formation of subgrains with continuous increase in misorientation is revealed during deformation, implying the accumulation of plastic slip at the strain-localised regions and the activation of slip systems (110)[11]/2 and (0)[111]/2.

Original languageEnglish
Pages (from-to)55-60
Number of pages6
JournalScripta Materialia
Volume175
DOIs
Publication statusPublished - 15 Jan 2020
Externally publishedYes

Keywords

  • In-situ thermal cycling
  • Microstructure evolution
  • Pb-free solder
  • Polygonization

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