Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder

Yilun Xu*, Tianhong Gu, Jingwei Xian, Finn Giuliani, T. Ben Britton, Christopher M. Gourlay, Fionn P.E. Dunne

*Corresponding author for this work

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29 Citations (Scopus)

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