TY - GEN
T1 - Tiled and layer-adaptive three-dimensional structured illumination microscopy based on principal component analysis
AU - Xia, Weiyi
AU - Qian, Jiaming
AU - Fan, Pengfei
AU - Zuo, Chao
N1 - Publisher Copyright:
© 2024 SPIE.
PY - 2024
Y1 - 2024
N2 - Three-dimensional (3D) Structured illumination microscopy (SIM) has become one of the most commonly implemented fluorescence super-resolution modes in life sciences due to its unique advantages of wide field of view, fast imaging, and weak phototoxicity and photobleaching. However, the traditional two-dimensional (2D) SIM suffers from the”missing cone” problem, which makes it impossible to realize true three-dimensional (3D) imaging. In order to solve this problem, 3D SIM has been developed to achieve twice the resolution in both lateral and axial directions. Recently, we propose a tiled and layer-adaptive 3D SIM based on principal component analysis (PCA) to solve the computational complexity and time-consuming, local perturbation of illumination parameters, and microscope moving mechanical errors faced by 3D SIM in parameter estimation. The algorithm accelerates and improves the accuracy of transverse and axial illumination parameters, which is expected to achieve fast, iteration-free, high-precision, high-quality 3D SIM super-resolution imaging.
AB - Three-dimensional (3D) Structured illumination microscopy (SIM) has become one of the most commonly implemented fluorescence super-resolution modes in life sciences due to its unique advantages of wide field of view, fast imaging, and weak phototoxicity and photobleaching. However, the traditional two-dimensional (2D) SIM suffers from the”missing cone” problem, which makes it impossible to realize true three-dimensional (3D) imaging. In order to solve this problem, 3D SIM has been developed to achieve twice the resolution in both lateral and axial directions. Recently, we propose a tiled and layer-adaptive 3D SIM based on principal component analysis (PCA) to solve the computational complexity and time-consuming, local perturbation of illumination parameters, and microscope moving mechanical errors faced by 3D SIM in parameter estimation. The algorithm accelerates and improves the accuracy of transverse and axial illumination parameters, which is expected to achieve fast, iteration-free, high-precision, high-quality 3D SIM super-resolution imaging.
KW - 3D SIM
KW - layer-adaptive
KW - parameter estimation
KW - principal component analysis
KW - tiled reconstruction
UR - http://www.scopus.com/inward/record.url?scp=85192970969&partnerID=8YFLogxK
U2 - 10.1117/12.3019549
DO - 10.1117/12.3019549
M3 - Conference Proceeding
AN - SCOPUS:85192970969
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Sixth Conference on Frontiers in Optical Imaging and Technology
A2 - Zhou, Yan
A2 - Zhang, Qiang
A2 - Xu, Feihu
A2 - Liu, Bo
PB - SPIE
T2 - 6th Conference on Frontiers in Optical Imaging and Technology: Novel Imaging Systems
Y2 - 22 October 2023 through 24 October 2023
ER -