TY - JOUR
T1 - Multi-scale plasticity homogenization of Sn–3Ag-0.5Cu
T2 - From β-Sn micropillars to polycrystals with intermetallics
AU - Xu, Yilun
AU - Gu, Tianhong
AU - Xian, Jingwei
AU - Giuliani, Finn
AU - Ben Britton, T.
AU - Gourlay, Christopher M.
AU - Dunne, Fionn P.E.
N1 - Publisher Copyright:
© 2022 The Authors
PY - 2022/10/10
Y1 - 2022/10/10
N2 - The mechanical properties of β-Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity modelling. The slip strength and rate sensitivity of several key slip systems within β-Sn single crystals have been determined. Consistency between the numerically predicted and experimentally observed slip traces has been shown for pillars oriented to activate single and double slip. Subsequently, the temperature-dependent, intermetallic-size-governing behaviour of a polycrystal β-Sn-rich alloy SAC305 (96.5Sn–3Ag-0.5Cu wt%) is predicted through a multi-scale homogenization approach, and the predicted temperature- and rate-sensitivity reproduce independent experimental results. The integrated experimental and numerical approaches provide mechanistic understanding and fundamental material properties of microstructure-sensitive behaviour of electronic solders subject to thermomechanical loading, including thermal fatigue.
AB - The mechanical properties of β-Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity modelling. The slip strength and rate sensitivity of several key slip systems within β-Sn single crystals have been determined. Consistency between the numerically predicted and experimentally observed slip traces has been shown for pillars oriented to activate single and double slip. Subsequently, the temperature-dependent, intermetallic-size-governing behaviour of a polycrystal β-Sn-rich alloy SAC305 (96.5Sn–3Ag-0.5Cu wt%) is predicted through a multi-scale homogenization approach, and the predicted temperature- and rate-sensitivity reproduce independent experimental results. The integrated experimental and numerical approaches provide mechanistic understanding and fundamental material properties of microstructure-sensitive behaviour of electronic solders subject to thermomechanical loading, including thermal fatigue.
KW - Crystal plasticity
KW - Lead-free solders
KW - Micropillar compression tests
KW - Rate sensitivity
UR - http://www.scopus.com/inward/record.url?scp=85138050500&partnerID=8YFLogxK
U2 - 10.1016/j.msea.2022.143876
DO - 10.1016/j.msea.2022.143876
M3 - Article
AN - SCOPUS:85138050500
SN - 0921-5093
VL - 855
JO - Materials Science and Engineering: A
JF - Materials Science and Engineering: A
M1 - 143876
ER -