TY - GEN
T1 - High-Performance Quasi-Vertical GaN Schottky Barrier Diode on Silicon Substrate with a Low Dislocation Density Drift Layer
AU - Li, Yue
AU - Yin, Ruiyuan
AU - Tao, Ming
AU - Hao, Yilong
AU - Wen, Cheng P.
AU - Wang, Maojun
AU - Zhang, Jie
AU - Yang, Xuelin
AU - Shen, Bo
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/6
Y1 - 2019/6
N2 - In this letter, based on a new growth strategy, we demonstrate a high-performance quasi-vertical GaN Schottky barrier diode (SBD) fabricated on the hetero-epitaxial layer on silicon, with the highest current on/off ratio of 1010, the lowest specific on-resistance of 0.95 mΩ·cm2, and the lowest ideality factor of 1.23 among the GaN quasi-vertical GaN SBD reported until now. It reveals the great potential of the GaN vertical structure device on Si thanks to the novel growth strategy, which is capable of realizing low density of threading dislocation and thick epitaxial layer at the same time.
AB - In this letter, based on a new growth strategy, we demonstrate a high-performance quasi-vertical GaN Schottky barrier diode (SBD) fabricated on the hetero-epitaxial layer on silicon, with the highest current on/off ratio of 1010, the lowest specific on-resistance of 0.95 mΩ·cm2, and the lowest ideality factor of 1.23 among the GaN quasi-vertical GaN SBD reported until now. It reveals the great potential of the GaN vertical structure device on Si thanks to the novel growth strategy, which is capable of realizing low density of threading dislocation and thick epitaxial layer at the same time.
KW - GaN
KW - Schottky barrier diode
KW - vertical structure
UR - http://www.scopus.com/inward/record.url?scp=85071447699&partnerID=8YFLogxK
U2 - 10.1109/ICICDT.2019.8790866
DO - 10.1109/ICICDT.2019.8790866
M3 - Conference Proceeding
AN - SCOPUS:85071447699
T3 - 17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Proceedings
BT - 17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th IEEE International Conference on IC Design and Technology, ICICDT 2019
Y2 - 17 June 2019 through 19 June 2019
ER -