TY - JOUR
T1 - Design, Fabrication, and Characterization of a Polymer-Based MEMS Uncooled Infrared Focal Plane Array
AU - Shang, Yuanfang
AU - Ye, Xiongying
AU - Wang, Min
AU - Song, Pengfei
AU - Feng, Jinyang
N1 - Publisher Copyright:
© 1992-2012 IEEE.
PY - 2015/8/1
Y1 - 2015/8/1
N2 - This paper presents the design, fabrication, and characterization of a polymer-based uncooled infrared (IR) focal-plane-array (FPA). In order to achieve high-temperature resolution, a thin-film IR absorber made of multiwalled carbon nanotubes (MWNTs) was adopted to absorb more than 90% of incident IR radiation. Furthermore, novel bimaterial microbeams composed of polyvinyl chloride and gold (Au), whose thermal expansion coefficient mismatch is up to 140 ppm/K, were utilized to convert the IR absorption-induced temperature rise to a thermal deflection with an ultrahigh sensitivity. The FPA was successfully fabricated with a low residual stress based on polymer surface micromachining techniques, and the MWNTs were integrated onto suspended microstructures in the FPA using a method combining screen printing with liftoff. To obtain a thermal image, an optical readout system utilizing an interferometric displacement detection based on integrated gratings was designed and implemented, which simultaneously measured the displacements of all pixels. Thermomechanical sensitivity of the fabricated FPA was measured to be 230 nm/K. Experimental results reveal that the current FPA is capable of detecting IR radiation power and temperature change in a target object with 27-nW and 14-K resolutions, respectively.
AB - This paper presents the design, fabrication, and characterization of a polymer-based uncooled infrared (IR) focal-plane-array (FPA). In order to achieve high-temperature resolution, a thin-film IR absorber made of multiwalled carbon nanotubes (MWNTs) was adopted to absorb more than 90% of incident IR radiation. Furthermore, novel bimaterial microbeams composed of polyvinyl chloride and gold (Au), whose thermal expansion coefficient mismatch is up to 140 ppm/K, were utilized to convert the IR absorption-induced temperature rise to a thermal deflection with an ultrahigh sensitivity. The FPA was successfully fabricated with a low residual stress based on polymer surface micromachining techniques, and the MWNTs were integrated onto suspended microstructures in the FPA using a method combining screen printing with liftoff. To obtain a thermal image, an optical readout system utilizing an interferometric displacement detection based on integrated gratings was designed and implemented, which simultaneously measured the displacements of all pixels. Thermomechanical sensitivity of the fabricated FPA was measured to be 230 nm/K. Experimental results reveal that the current FPA is capable of detecting IR radiation power and temperature change in a target object with 27-nW and 14-K resolutions, respectively.
KW - Infrared detection
KW - bi-material
KW - focal-plane-array (FPA)
KW - microfabrication.
KW - optical readout
KW - polymer
KW - uncooled
UR - http://www.scopus.com/inward/record.url?scp=85027916852&partnerID=8YFLogxK
U2 - 10.1109/JMEMS.2014.2386871
DO - 10.1109/JMEMS.2014.2386871
M3 - Article
AN - SCOPUS:85027916852
SN - 1057-7157
VL - 24
SP - 1132
EP - 1141
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
IS - 4
M1 - 7015541
ER -