Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System

Shuqi Jin, Renjie Yin, Yuting Li, Wen Quan Tao*

*Corresponding author for this work

Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

Abstract

The current trend of miniaturization, integration and high density of electronic devices drives up the heat flow density of data centers, resulting in the traditional air-cooled cooling mode approaching its theoretical heat transfer limit. Immersion cooling method has a great potential to cool electronic devices by submerging them into thermally conductive dielectric liquids. In this study, efforts are focused on single-phase immersion cooling and a numerical model of PCB-level immersion cooling tank is constructed. Three mainboards are arrayed and submerged in a dielectric fluid (FC40). Each mainboard has four CPUs that provide the heat power. The straight-finned heat sink is attached on each CPU surface. The effects of the different heat loads, the multi-PCB arrangements, the inlet-outlet locations of the flowing liquid and the variation of inlet temperature on the heat transfer performance are analyzed through the temperature of the CPU and thermal resistance of this immersion cooling system.

Original languageEnglish
Title of host publicationAdvances in Computational Heat and Mass Transfer - Proceedings of the 14th International Conference on Computational Heat and Mass Transfer ICCHMT 2023
EditorsAli Cemal Benim, Rachid Bennacer, Abdulmajeed A. Mohamad, Paweł Ocłoń, Jan Taler, Sang-Ho Suh
PublisherSpringer Science and Business Media Deutschland GmbH
Pages301-311
Number of pages11
ISBN (Print)9783031672408
DOIs
Publication statusPublished - 2024
Externally publishedYes
Event14th International Conference on Computational Heat and Mass Transfer, ICCHMT 2023 - Düsseldorf, Germany
Duration: 4 Sept 20238 Sept 2023

Publication series

NameLecture Notes in Mechanical Engineering
ISSN (Print)2195-4356
ISSN (Electronic)2195-4364

Conference

Conference14th International Conference on Computational Heat and Mass Transfer, ICCHMT 2023
Country/TerritoryGermany
CityDüsseldorf
Period4/09/238/09/23

Keywords

  • Data center
  • Electronical devices
  • Numerical Simulation
  • Single-Phase Immersion Cooling

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