TY - GEN
T1 - Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System
AU - Jin, Shuqi
AU - Yin, Renjie
AU - Li, Yuting
AU - Tao, Wen Quan
N1 - Publisher Copyright:
© The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.
PY - 2024
Y1 - 2024
N2 - The current trend of miniaturization, integration and high density of electronic devices drives up the heat flow density of data centers, resulting in the traditional air-cooled cooling mode approaching its theoretical heat transfer limit. Immersion cooling method has a great potential to cool electronic devices by submerging them into thermally conductive dielectric liquids. In this study, efforts are focused on single-phase immersion cooling and a numerical model of PCB-level immersion cooling tank is constructed. Three mainboards are arrayed and submerged in a dielectric fluid (FC40). Each mainboard has four CPUs that provide the heat power. The straight-finned heat sink is attached on each CPU surface. The effects of the different heat loads, the multi-PCB arrangements, the inlet-outlet locations of the flowing liquid and the variation of inlet temperature on the heat transfer performance are analyzed through the temperature of the CPU and thermal resistance of this immersion cooling system.
AB - The current trend of miniaturization, integration and high density of electronic devices drives up the heat flow density of data centers, resulting in the traditional air-cooled cooling mode approaching its theoretical heat transfer limit. Immersion cooling method has a great potential to cool electronic devices by submerging them into thermally conductive dielectric liquids. In this study, efforts are focused on single-phase immersion cooling and a numerical model of PCB-level immersion cooling tank is constructed. Three mainboards are arrayed and submerged in a dielectric fluid (FC40). Each mainboard has four CPUs that provide the heat power. The straight-finned heat sink is attached on each CPU surface. The effects of the different heat loads, the multi-PCB arrangements, the inlet-outlet locations of the flowing liquid and the variation of inlet temperature on the heat transfer performance are analyzed through the temperature of the CPU and thermal resistance of this immersion cooling system.
KW - Data center
KW - Electronical devices
KW - Numerical Simulation
KW - Single-Phase Immersion Cooling
UR - http://www.scopus.com/inward/record.url?scp=85203595940&partnerID=8YFLogxK
U2 - 10.1007/978-3-031-67241-5_27
DO - 10.1007/978-3-031-67241-5_27
M3 - Conference Proceeding
AN - SCOPUS:85203595940
SN - 9783031672408
T3 - Lecture Notes in Mechanical Engineering
SP - 301
EP - 311
BT - Advances in Computational Heat and Mass Transfer - Proceedings of the 14th International Conference on Computational Heat and Mass Transfer ICCHMT 2023
A2 - Benim, Ali Cemal
A2 - Bennacer, Rachid
A2 - Mohamad, Abdulmajeed A.
A2 - Ocłoń, Paweł
A2 - Taler, Jan
A2 - Suh, Sang-Ho
PB - Springer Science and Business Media Deutschland GmbH
T2 - 14th International Conference on Computational Heat and Mass Transfer, ICCHMT 2023
Y2 - 4 September 2023 through 8 September 2023
ER -