Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System

Shuqi Jin; Renjie Yin; Yuting Li; Wen Quan Tao

doi:10.1007/978-3-031-67241-5_27

Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System

Shuqi Jin, Renjie Yin, Yuting Li, Wen Quan Tao^*

^*Corresponding author for this work

Xi'an Jiaotong University

Research output: Chapter in Book or Report/Conference proceeding › Conference Proceeding › peer-review

Abstract

The current trend of miniaturization, integration and high density of electronic devices drives up the heat flow density of data centers, resulting in the traditional air-cooled cooling mode approaching its theoretical heat transfer limit. Immersion cooling method has a great potential to cool electronic devices by submerging them into thermally conductive dielectric liquids. In this study, efforts are focused on single-phase immersion cooling and a numerical model of PCB-level immersion cooling tank is constructed. Three mainboards are arrayed and submerged in a dielectric fluid (FC40). Each mainboard has four CPUs that provide the heat power. The straight-finned heat sink is attached on each CPU surface. The effects of the different heat loads, the multi-PCB arrangements, the inlet-outlet locations of the flowing liquid and the variation of inlet temperature on the heat transfer performance are analyzed through the temperature of the CPU and thermal resistance of this immersion cooling system.

Original language	English
Title of host publication	Advances in Computational Heat and Mass Transfer - Proceedings of the 14th International Conference on Computational Heat and Mass Transfer ICCHMT 2023
Editors	Ali Cemal Benim, Rachid Bennacer, Abdulmajeed A. Mohamad, Paweł Ocłoń, Jan Taler, Sang-Ho Suh
Publisher	Springer Science and Business Media Deutschland GmbH
Pages	301-311
Number of pages	11
ISBN (Print)	9783031672408
DOIs	https://doi.org/10.1007/978-3-031-67241-5_27
Publication status	Published - 2024
Externally published	Yes
Event	14th International Conference on Computational Heat and Mass Transfer, ICCHMT 2023 - Düsseldorf, Germany Duration: 4 Sept 2023 → 8 Sept 2023

Publication series

Name	Lecture Notes in Mechanical Engineering
ISSN (Print)	2195-4356
ISSN (Electronic)	2195-4364

Conference

Conference	14th International Conference on Computational Heat and Mass Transfer, ICCHMT 2023
Country/Territory	Germany
City	Düsseldorf
Period	4/09/23 → 8/09/23

Keywords

Data center
Electronical devices
Numerical Simulation
Single-Phase Immersion Cooling

Access to Document

10.1007/978-3-031-67241-5_27

Cite this

Jin, S., Yin, R., Li, Y., & Tao, W. Q. (2024). Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System. In A. C. Benim, R. Bennacer, A. A. Mohamad, P. Ocłoń, J. Taler, & S.-H. Suh (Eds.), Advances in Computational Heat and Mass Transfer - Proceedings of the 14th International Conference on Computational Heat and Mass Transfer ICCHMT 2023 (pp. 301-311). (Lecture Notes in Mechanical Engineering). Springer Science and Business Media Deutschland GmbH. https://doi.org/10.1007/978-3-031-67241-5_27

Jin, Shuqi ; Yin, Renjie ; Li, Yuting et al. / Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System. Advances in Computational Heat and Mass Transfer - Proceedings of the 14th International Conference on Computational Heat and Mass Transfer ICCHMT 2023. editor / Ali Cemal Benim ; Rachid Bennacer ; Abdulmajeed A. Mohamad ; Paweł Ocłoń ; Jan Taler ; Sang-Ho Suh. Springer Science and Business Media Deutschland GmbH, 2024. pp. 301-311 (Lecture Notes in Mechanical Engineering).

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title = "Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System",

abstract = "The current trend of miniaturization, integration and high density of electronic devices drives up the heat flow density of data centers, resulting in the traditional air-cooled cooling mode approaching its theoretical heat transfer limit. Immersion cooling method has a great potential to cool electronic devices by submerging them into thermally conductive dielectric liquids. In this study, efforts are focused on single-phase immersion cooling and a numerical model of PCB-level immersion cooling tank is constructed. Three mainboards are arrayed and submerged in a dielectric fluid (FC40). Each mainboard has four CPUs that provide the heat power. The straight-finned heat sink is attached on each CPU surface. The effects of the different heat loads, the multi-PCB arrangements, the inlet-outlet locations of the flowing liquid and the variation of inlet temperature on the heat transfer performance are analyzed through the temperature of the CPU and thermal resistance of this immersion cooling system.",

keywords = "Data center, Electronical devices, Numerical Simulation, Single-Phase Immersion Cooling",

author = "Shuqi Jin and Renjie Yin and Yuting Li and Tao, {Wen Quan}",

note = "Publisher Copyright: {\textcopyright} The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.; 14th International Conference on Computational Heat and Mass Transfer, ICCHMT 2023 ; Conference date: 04-09-2023 Through 08-09-2023",

year = "2024",

doi = "10.1007/978-3-031-67241-5_27",

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Jin, S, Yin, R, Li, Y & Tao, WQ 2024, Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System. in AC Benim, R Bennacer, AA Mohamad, P Ocłoń, J Taler & S-H Suh (eds), Advances in Computational Heat and Mass Transfer - Proceedings of the 14th International Conference on Computational Heat and Mass Transfer ICCHMT 2023. Lecture Notes in Mechanical Engineering, Springer Science and Business Media Deutschland GmbH, pp. 301-311, 14th International Conference on Computational Heat and Mass Transfer, ICCHMT 2023, Düsseldorf, Germany, 4/09/23. https://doi.org/10.1007/978-3-031-67241-5_27

Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System. / Jin, Shuqi; Yin, Renjie; Li, Yuting et al.
Advances in Computational Heat and Mass Transfer - Proceedings of the 14th International Conference on Computational Heat and Mass Transfer ICCHMT 2023. ed. / Ali Cemal Benim; Rachid Bennacer; Abdulmajeed A. Mohamad; Paweł Ocłoń; Jan Taler; Sang-Ho Suh. Springer Science and Business Media Deutschland GmbH, 2024. p. 301-311 (Lecture Notes in Mechanical Engineering).

Research output: Chapter in Book or Report/Conference proceeding › Conference Proceeding › peer-review

TY - GEN

T1 - Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System

AU - Jin, Shuqi

AU - Yin, Renjie

AU - Li, Yuting

AU - Tao, Wen Quan

N1 - Publisher Copyright: © The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.

PY - 2024

Y1 - 2024

N2 - The current trend of miniaturization, integration and high density of electronic devices drives up the heat flow density of data centers, resulting in the traditional air-cooled cooling mode approaching its theoretical heat transfer limit. Immersion cooling method has a great potential to cool electronic devices by submerging them into thermally conductive dielectric liquids. In this study, efforts are focused on single-phase immersion cooling and a numerical model of PCB-level immersion cooling tank is constructed. Three mainboards are arrayed and submerged in a dielectric fluid (FC40). Each mainboard has four CPUs that provide the heat power. The straight-finned heat sink is attached on each CPU surface. The effects of the different heat loads, the multi-PCB arrangements, the inlet-outlet locations of the flowing liquid and the variation of inlet temperature on the heat transfer performance are analyzed through the temperature of the CPU and thermal resistance of this immersion cooling system.

AB - The current trend of miniaturization, integration and high density of electronic devices drives up the heat flow density of data centers, resulting in the traditional air-cooled cooling mode approaching its theoretical heat transfer limit. Immersion cooling method has a great potential to cool electronic devices by submerging them into thermally conductive dielectric liquids. In this study, efforts are focused on single-phase immersion cooling and a numerical model of PCB-level immersion cooling tank is constructed. Three mainboards are arrayed and submerged in a dielectric fluid (FC40). Each mainboard has four CPUs that provide the heat power. The straight-finned heat sink is attached on each CPU surface. The effects of the different heat loads, the multi-PCB arrangements, the inlet-outlet locations of the flowing liquid and the variation of inlet temperature on the heat transfer performance are analyzed through the temperature of the CPU and thermal resistance of this immersion cooling system.

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A2 - Mohamad, Abdulmajeed A.

A2 - Ocłoń, Paweł

A2 - Taler, Jan

A2 - Suh, Sang-Ho

PB - Springer Science and Business Media Deutschland GmbH

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ER -

Jin S, Yin R, Li Y, Tao WQ. Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System. In Benim AC, Bennacer R, Mohamad AA, Ocłoń P, Taler J, Suh SH, editors, Advances in Computational Heat and Mass Transfer - Proceedings of the 14th International Conference on Computational Heat and Mass Transfer ICCHMT 2023. Springer Science and Business Media Deutschland GmbH. 2024. p. 301-311. (Lecture Notes in Mechanical Engineering). doi: 10.1007/978-3-031-67241-5_27

Numerical Investigation on Heat Transfer Performance of a Single-Phase Immersion Cooling System

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