Failure mechanism of 4H-SiC junction barrier Schottky diodes under harsh thermal cycling stress

Yuan Lan Zhang, Jie Zhang, Hong Ping Ma, Yan Qing Chi, Hao Ran Tian, Jian Hua Liu, Qi Bin Liu, Zhong Guo Chen, Qingchun Jon Zhang*

*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

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