Fingerprint
Dive into the research topics of 'Failure Analysis and Shape Optimization of Bonding Wire for SiC Power Module Encapsulated with Epoxy Resin'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Failure Analysis and Shape Optimization of Bonding Wire for SiC Power Module Encapsulated with Epoxy Resin
Sanli Liu, Min Chen*, Nan Zhu, Zhouyi Xiang, Shunqi Zhang
*Corresponding author for this work
Research output: Chapter in Book or Report/Conference proceeding › Conference Proceeding › peer-review