Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder

Material Science

• Microstructure 100%
• Creep 100%
• Strain 60%
• Temperature 60%
• Strain Rate 40%
• Fiber 20%
• Correlation 20%
• Electron Backscatter Diffraction 20%
• Deformation Mechanism 20%
• Bone 20%
• Tensile Testing 20%
• Load Testing 20%
• Solder Joint 20%
• Thermal Fatigue 20%
• Secondary Creep 20%
• Thermomechanical Property 20%

Physics

• Temperature 40%
• Differences 20%
• Region 20%
• Dimensions 20%
• Increasing 20%
• Gradients 20%
• Reliability 20%
• Digital Image 20%
• Deformation 20%
• Correlation 20%
• Joint 20%
• Diffraction 20%
• Measuring Instruments 20%
• Electrons 20%
• Temperature Dependence 20%
• Solder 20%

Engineering

• Strain Gradient 20%
• Fiber Texture 20%
• Increasing Strain 20%
• Creep Strain 20%
• Subgrains 20%
• Backscatter 20%