TY - GEN
T1 - Elastic EDA
T2 - 42nd IEEE International Conference on Computer Design, ICCD 2024
AU - Zhu, Linyu
AU - Ma, Xingyu
AU - Hao, Shaogang
AU - Pan, Yushan
AU - Guo, Xinfei
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Utilizing cloud EDA for chip design allows access to on-demand high-performance computing (HPC) resources, significantly reducing development time and costs by eliminating the need for costly on-site infrastructure. Despite its benefits, cloud EDA faces significant challenges, primarily the lack of an effective cost model. A key issue is the absence of a mechanism for designers to accurately gauge the characteristics of their EDA jobs in cloud environment, as the design process involves a multitude of EDA tools and steps, often leading to the over or underestimation of needed computational resources. This problem is exacerbated by the varying computational demands of different designs and constraints. To bridge this knowledge gap, we introduce Elastic EDA, a methodology that harnesses machine learning (ML) to understand the characteristics of a design and its early stages, and to predict the computational needs for subsequent phases throughout the entire EDA flow. This approach effectively aligns design behaviors with computational resources, providing cost-efficient solutions for various cloud EDA scenarios. Compared to previous ML-based predictive frameworks for cloud EDA, the proposed method achieves over 60% higher prediction accuracy and supports various elastic computing environments, maximizing the efficiency of cloud re-sources. Compared to various baseline scheduling configurations in the cloud environment, the proposed framework achieves over 16% mean runtime improvement.
AB - Utilizing cloud EDA for chip design allows access to on-demand high-performance computing (HPC) resources, significantly reducing development time and costs by eliminating the need for costly on-site infrastructure. Despite its benefits, cloud EDA faces significant challenges, primarily the lack of an effective cost model. A key issue is the absence of a mechanism for designers to accurately gauge the characteristics of their EDA jobs in cloud environment, as the design process involves a multitude of EDA tools and steps, often leading to the over or underestimation of needed computational resources. This problem is exacerbated by the varying computational demands of different designs and constraints. To bridge this knowledge gap, we introduce Elastic EDA, a methodology that harnesses machine learning (ML) to understand the characteristics of a design and its early stages, and to predict the computational needs for subsequent phases throughout the entire EDA flow. This approach effectively aligns design behaviors with computational resources, providing cost-efficient solutions for various cloud EDA scenarios. Compared to previous ML-based predictive frameworks for cloud EDA, the proposed method achieves over 60% higher prediction accuracy and supports various elastic computing environments, maximizing the efficiency of cloud re-sources. Compared to various baseline scheduling configurations in the cloud environment, the proposed framework achieves over 16% mean runtime improvement.
KW - Cloud
KW - EDA
KW - Elastic computing
KW - Machine learning
KW - Resource prediction
UR - http://www.scopus.com/inward/record.url?scp=85217023375&partnerID=8YFLogxK
U2 - 10.1109/ICCD63220.2024.00031
DO - 10.1109/ICCD63220.2024.00031
M3 - Conference Proceeding
AN - SCOPUS:85217023375
T3 - Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors
SP - 144
EP - 153
BT - Proceedings - 2024 IEEE 42nd International Conference on Computer Design, ICCD 2024
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 18 November 2024 through 20 November 2024
ER -