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Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
Wei Sun, Lizhe Wang, Nan Zhu, Jiyuan Xin, Yunchao Luo, Xingrui Jiang, Guohua Fan*, Min Chen
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
4
Citations
(Scopus)