Voltage step stress: A technique for reducing test time of device ageing

J. F. Zhang, Z. Ji, M. Duan, W. Zhang, C. Z. Zhao

Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

2 Citations (Scopus)

Abstract

Device ageing leads to circuit malfunction and must be controlled. During ageing, defects build up slowly and the test is time consuming and costly. The typical ageing tests are repeated 5 times under different voltages. To reduce the test time, the voltage step stress (VSS) technique is proposed, which replaces the multiple tests under different voltage by a single test and saves time. This paper reviews the recent development of the VSS technique. After presenting its underlying principle, its applicability will be demonstrated for both the negative bias temperature instability and hot carrier ageing.

Original languageEnglish
Title of host publication17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728118536
DOIs
Publication statusPublished - Jun 2019
Event17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Suzhou, China
Duration: 17 Jun 201919 Jun 2019

Publication series

Name17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Proceedings

Conference

Conference17th IEEE International Conference on IC Design and Technology, ICICDT 2019
Country/TerritoryChina
CitySuzhou
Period17/06/1919/06/19

Keywords

  • Ageing
  • Defects
  • Degradation
  • Hot carriers
  • Instabilities
  • Lifetime
  • NBTI

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