TY - GEN
T1 - Vibration analysis of pMUT with polymer adhesion layer
AU - Yaacob, Mohd Ikhwan Hadi
AU - Arshad, Mohd Rizal
AU - Manaf, Asrulnizam Abd
AU - Rahman, Mohamad Faizal Abd
PY - 2011
Y1 - 2011
N2 - Wafer bonding using polymer adhesive layer has gained many attentions for various MEMS applications. Numerous techniques and processes that utilize polymer adhesive have been established recently, mainly for wafer bonding and device packaging. However, adhesive layer contribution in vibrating micro structure such as micro ultrasonic transducer requires further investigations. This paper reports performance difference of piezoelectric micro ultrasonic transducer (pMUT) with polymer adhesion layer of PDMS, Cytop and Polyimide. Finite element analysis was utilized to analyze structure behavior during vibration. Frequency analysis revealed 41 kHz shift in device's resonant frequency when different type of polymers employed as adhesive layer. Further investigations through piezoelectric analysis found that PDMS has contributed in 40% decrease of voltage response than other two polymers at only 610 5 m/V, but carry the highest stress response at 210 5 m/Pa in both transmit and receive modes in mechanical analysis. Finally, same analysis cycle was conducted on pMUT structure with polymer adhesive layer being replaced by polysilicon at the same thickness.
AB - Wafer bonding using polymer adhesive layer has gained many attentions for various MEMS applications. Numerous techniques and processes that utilize polymer adhesive have been established recently, mainly for wafer bonding and device packaging. However, adhesive layer contribution in vibrating micro structure such as micro ultrasonic transducer requires further investigations. This paper reports performance difference of piezoelectric micro ultrasonic transducer (pMUT) with polymer adhesion layer of PDMS, Cytop and Polyimide. Finite element analysis was utilized to analyze structure behavior during vibration. Frequency analysis revealed 41 kHz shift in device's resonant frequency when different type of polymers employed as adhesive layer. Further investigations through piezoelectric analysis found that PDMS has contributed in 40% decrease of voltage response than other two polymers at only 610 5 m/V, but carry the highest stress response at 210 5 m/Pa in both transmit and receive modes in mechanical analysis. Finally, same analysis cycle was conducted on pMUT structure with polymer adhesive layer being replaced by polysilicon at the same thickness.
KW - Adhesive
KW - Piezoelectric
KW - Polymer
KW - Ultrasonic
UR - http://www.scopus.com/inward/record.url?scp=83755173909&partnerID=8YFLogxK
U2 - 10.1109/RSM.2011.6088290
DO - 10.1109/RSM.2011.6088290
M3 - Conference Proceeding
AN - SCOPUS:83755173909
SN - 9781612848464
T3 - 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts
SP - 52
EP - 55
BT - 2011 IEEE Regional Symposium on Micro and Nanoelectronics, RSM 2011 - Programme and Abstracts
T2 - 2011 IEEE Regional Symposium on Micro and Nano Electronics, RSM 2011
Y2 - 28 September 2011 through 30 September 2011
ER -