TY - GEN
T1 - Threshold Voltage Instability in D-mode AlGaN/GaN MIS-HEMTs with Al2O3 Gate Dielectric
AU - Liang, Ye
AU - Zhang, Yuanlei
AU - Cai, Yutao
AU - Wang, Zhaoyi
AU - Zhao, Yinchao
AU - Wen, Huiqing
AU - Liu, Wen
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - In this paper, D-mode MIS-HEMTs with 24 nm ALD-Al2O3 gate dielectric are studied. The electrical parameters, such as threshold voltage (Vth), drain current (Ids), on-resistant (Ron), sub-threshold swing (SS), and gate leakage current (Ileak) are investigated during the gate stress phase and recovery phase at room temperature. It is found that, during the stress phase, Vth and Ron show positive shifts while Ids show negative shifts. It is because channel electrons are trapped by the dielectric/III-nitride interface layer and by the bulk traps in the gate dielectric. However, these electrical parameter changes cannot be fully recoverable at the end of the recovery phase, followed by 30 mins thermal de-trapping. It may be caused by (1) positive gate bias induced unrecoverable defects in the dielectric layer. (2) bulk trap has a relatively large emission constant. (3) AlGaN barrier exists between the channel and dielectric/III-nitride interface layer, make the electrons hard to exchanges.
AB - In this paper, D-mode MIS-HEMTs with 24 nm ALD-Al2O3 gate dielectric are studied. The electrical parameters, such as threshold voltage (Vth), drain current (Ids), on-resistant (Ron), sub-threshold swing (SS), and gate leakage current (Ileak) are investigated during the gate stress phase and recovery phase at room temperature. It is found that, during the stress phase, Vth and Ron show positive shifts while Ids show negative shifts. It is because channel electrons are trapped by the dielectric/III-nitride interface layer and by the bulk traps in the gate dielectric. However, these electrical parameter changes cannot be fully recoverable at the end of the recovery phase, followed by 30 mins thermal de-trapping. It may be caused by (1) positive gate bias induced unrecoverable defects in the dielectric layer. (2) bulk trap has a relatively large emission constant. (3) AlGaN barrier exists between the channel and dielectric/III-nitride interface layer, make the electrons hard to exchanges.
KW - ALD-Al 2 O 3
KW - MIS-HEMTs
KW - depletion-mode (D-mode)
KW - gallium nitride
KW - on-resistance
KW - threshold voltage instability
UR - http://www.scopus.com/inward/record.url?scp=85123601577&partnerID=8YFLogxK
U2 - 10.1109/ICICDT51558.2021.9626513
DO - 10.1109/ICICDT51558.2021.9626513
M3 - Conference Proceeding
AN - SCOPUS:85123601577
T3 - 2021 International Conference on IC Design and Technology, ICICDT 2021
BT - 2021 International Conference on IC Design and Technology, ICICDT 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 International Conference on IC Design and Technology, ICICDT 2021
Y2 - 15 September 2021 through 17 September 2021
ER -