Study of PEALD-AlN as Dielectric Layer in GaN MIS-HEMTs

Xuanming Zhang, Xiang Fu, Yuanlei Zhang, Jiachen Duan, Zhijie Kong, Wen Liu*

*Corresponding author for this work

Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

Abstract

In this paper, the Aluminum Nitride (AlN) film was investigated based on Plasma-Enhanced Atomic Layer Deposition (PEALD) by varying process parameters (RF power, NH3 pulse time, temperature). The optimized AlN achieved a high breakdown voltage of 18 V on Si. The 10 nm AlN film is demonstrated as a dielectric layer in GaN MIS- HEMTs. The devices exhibited a threshold voltage ($V_{\text{TH}}$) of -4.4 V and a peak transconductance (gmax) that reached 171.3 mS/mm. Furthermore, the leakage current test results indicate that the device exhibits characteristics more aligned with Schottky contact performance.

Original languageEnglish
Title of host publication2023 20th China International Forum on Solid State Lighting and 2023 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA
Subtitle of host publicationIFWS 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages181-182
Number of pages2
ISBN (Electronic)9798350385373
DOIs
Publication statusPublished - 2023
Event20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023 - Xiamen, Fujian, China
Duration: 27 Nov 202330 Nov 2023

Publication series

Name2023 20th China International Forum on Solid State Lighting and 2023 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023

Conference

Conference20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023
Country/TerritoryChina
CityXiamen, Fujian
Period27/11/2330/11/23

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