Abstract
A 27-MHz wireless transmitter is fabricated with all the off-chip inductors, capacitors and resistors built on a thin organic substrate. The transmitter module occupies an area of 25mm×25mm. It includes the transistor circuits on a silicon chip and off-chip passive circuits with large-value inductors and capacitors. The newly packaged transmitter module functions properly and gives a 5 dB higher output power while other performances are comparable to that of the counterpart assembled using discrete passive components. It demonstrates the possible system-on-package (SOP) solution of radio-frequency (RF) systems using the embedded passives.
Original language | English |
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Pages (from-to) | 1704-1710 |
Number of pages | 7 |
Journal | Proceedings - Electronic Components and Technology Conference |
Volume | 2 |
Publication status | Published - 2005 |
Externally published | Yes |
Event | 55th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States Duration: 31 May 2005 → 4 Jun 2005 |