Projects per year
Abstract
Inexpensive, high-speed deposition techniques that ensure uniformity, scalability, wide applicability, and tunable thickness are crucial for the practical application of 2D materials. In this work, rapid drying is identified as a key mechanism for pioneering two high-speed wet deposition methods: hot dipping and air knife sweeping (AKS). Both techniques allow thickness control proportional to flake concentration, achieving tiled monolayers and pinhole-free coverage across the entire substrate, as long as evaporation outpaces flake diffusion. AKS prevents non-uniformity along substrate edges by eliminating contact line pinning. The achieved deposition speed of 0.21 m2 min−1 with AKS significantly surpasses traditional methods, enabling the equipment for large substrates > 1 m2. Combined with the ultralow debonding force for mechanically susceptible flexible display production and short-circuit-proof nanometer-thin capacitors with capacitance comparable to commercial multilayer ceramic capacitors (MLCCs), these new protocols showcase simple and swift solutions for manufacturing 2D materials-based nanodevices.
Original language | English |
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Article number | 2411447 |
Journal | Advanced Materials |
Volume | 37 |
Issue number | 15 |
DOIs | |
Publication status | Published - 16 Apr 2025 |
Keywords
- 2D materials
- m min scale deposition speed
- monolayer
- pinhole-free
- rapid drying principle
Projects
- 1 Active
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Atomic-scale control of functional nanomaterials in energy conversion technology, pharmaceutical science, and semiconductor processing
1/10/24 → 1/10/27
Project: Internal Research Project