Plasma-Enhanced Combustion-Processed Al Gate Oxide for in Thin Film Transistors

Q. H. Liu, C. Zhao, C. Z. Zhao, I. Z. Mitrovic, S. Hall, W. Y. Xu, L. Yang, E. G. Lim, Q. N. Wang, Y. L. Wei, Y. X. Cao

Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

Abstract

In this study, we describe how to obtain high-quality Al dielectric thin films and their implementation in In thin film transistors by combining plasma treatment and combustion process at low temperatures (250 °C). The single layer Al dielectric formed by this technique exhibited a higher areal capacitance and a lower leakage level compared with those of conventional solution-processed Al. The resulting TFTs presented a superior electrical performance at a low operating voltage of 2 V, with a positive threshold voltage of 0.39 V, a subthreshold swing of 0.V/decade, an On/Off ratio of 1.8×104, and a superior mobility of 136 cm2 V-1 s-1.

Original languageEnglish
Title of host publication17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728118536
DOIs
Publication statusPublished - Jun 2019
Event17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Suzhou, China
Duration: 17 Jun 201919 Jun 2019

Publication series

Name17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Proceedings

Conference

Conference17th IEEE International Conference on IC Design and Technology, ICICDT 2019
Country/TerritoryChina
CitySuzhou
Period17/06/1919/06/19

Keywords

  • Low-temperature
  • Solution-processed
  • combustion synthesis
  • environmentally friendly
  • metal oxide thin-film transistors

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