TY - GEN
T1 - Neural Radiance Fields Assist in Object Grab for Digital Twins
AU - An, Jiabao
AU - Long, Bojun
AU - Zhu, Yuyi
AU - Chen, Yi
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - The Fourth Industrial Revolution, a transformative milestone in modern history, has introduced significant enhancements to traditional manufacturing industries and given rise to novel manufacturing systems. Industry 4.0 technology, which underpins this transformation, is characterized by the integration of digital twin technology - an essential component for bridging physical and digital information. However, current realtime digital twin systems predominantly focus on conveying mechanical information while largely neglecting macroscopic visual information observable by the naked eye. This paper proposes a method to augment digital twin technology by leveraging neural radiance fields, thereby facilitating the observation of dynamic non-mechanical information in real-world settings.
AB - The Fourth Industrial Revolution, a transformative milestone in modern history, has introduced significant enhancements to traditional manufacturing industries and given rise to novel manufacturing systems. Industry 4.0 technology, which underpins this transformation, is characterized by the integration of digital twin technology - an essential component for bridging physical and digital information. However, current realtime digital twin systems predominantly focus on conveying mechanical information while largely neglecting macroscopic visual information observable by the naked eye. This paper proposes a method to augment digital twin technology by leveraging neural radiance fields, thereby facilitating the observation of dynamic non-mechanical information in real-world settings.
KW - Digital Twins
KW - neural radiance fields
KW - Reality Capture
KW - Robot Arm
UR - http://www.scopus.com/inward/record.url?scp=85187341948&partnerID=8YFLogxK
U2 - 10.1109/SWC57546.2023.10449148
DO - 10.1109/SWC57546.2023.10449148
M3 - Conference Proceeding
AN - SCOPUS:85187341948
T3 - Proceedings - 2023 IEEE SmartWorld, Ubiquitous Intelligence and Computing, Autonomous and Trusted Vehicles, Scalable Computing and Communications, Digital Twin, Privacy Computing and Data Security, Metaverse, SmartWorld/UIC/ATC/ScalCom/DigitalTwin/PCDS/Metaverse 2023
BT - Proceedings - 2023 IEEE SmartWorld, Ubiquitous Intelligence and Computing, Autonomous and Trusted Vehicles, Scalable Computing and Communications, Digital Twin, Privacy Computing and Data Security, Metaverse, SmartWorld/UIC/ATC/ScalCom/DigitalTwin/PCDS/Metaverse 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 9th IEEE Smart World Congress, SWC 2023
Y2 - 28 August 2023 through 31 August 2023
ER -