TY - GEN
T1 - Compliance current effect on switching behavior of hafnium oxide based RRAM
AU - Qi, Yanfei
AU - Zhao, Chun
AU - Fang, Yuxiao
AU - Lu, Qifeng
AU - Liu, Chenguang
AU - Yang, Li
AU - Zhao, Ce Zhou
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/10/5
Y1 - 2017/10/5
N2 - In this study, we compared the basic switching behaviors of HfO2, Al2O3 and HfAlOx (Hf: Al=9:1) based RRAM with Ti top electrode by setting various compliance currents (1mA, 5mA, 10mA, 15mA). The resistance ratio of HfO2 based RRAM (20 → 320) increases with compliance current whereas it drops not obviously for Al2O3 based RRAM (85→54). HfAlOx (Hf: Al=9:1)) based one has the best resistance ratio (300-440) and resistance stability. All low resistance state (LRS) resistance values of three samples are around 100Ω with large compliance current while there is a difference in HRS resistance which causes the ratio difference accordingly. The dominant mechanism of resistive switching is the formation and rupture of the conductive filament composed of oxygen vacancies. The appropriate compliance current selection and doping technology to high-k materials should be considered in further study.
AB - In this study, we compared the basic switching behaviors of HfO2, Al2O3 and HfAlOx (Hf: Al=9:1) based RRAM with Ti top electrode by setting various compliance currents (1mA, 5mA, 10mA, 15mA). The resistance ratio of HfO2 based RRAM (20 → 320) increases with compliance current whereas it drops not obviously for Al2O3 based RRAM (85→54). HfAlOx (Hf: Al=9:1)) based one has the best resistance ratio (300-440) and resistance stability. All low resistance state (LRS) resistance values of three samples are around 100Ω with large compliance current while there is a difference in HRS resistance which causes the ratio difference accordingly. The dominant mechanism of resistive switching is the formation and rupture of the conductive filament composed of oxygen vacancies. The appropriate compliance current selection and doping technology to high-k materials should be considered in further study.
UR - http://www.scopus.com/inward/record.url?scp=85045073351&partnerID=8YFLogxK
U2 - 10.1109/IPFA.2017.8060188
DO - 10.1109/IPFA.2017.8060188
M3 - Conference Proceeding
AN - SCOPUS:85045073351
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
SP - 1
EP - 4
BT - 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2017
Y2 - 4 July 2017 through 7 July 2017
ER -