TY - GEN
T1 - Compact bandpass filter based on hybrid spoof surface plasmon and substrate integrated waveguide transmission line
AU - Rudramuni, Karthik
AU - Kandasamy, Krishnamoorthy
AU - Kandwal, Abhishek
AU - Zhang, Qingfeng
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - In this paper, spoof surface plasmon polariton (SSPPs) and substrate integrated waveguide (SIW) based bandpass filter is proposed. The metal strip on the top of the substrate is composed of periodic slots which supports surface wave mode of SPP within the closed substrate integrated waveguide. The dispersion relation of the proposed structure shows that it has both low-pass feature of SSP and the high-pass feature of SIW, and hence the combination of these two features leads to a bandpass filter (BPF). The results show that the passband is from 11.5-19 GHz with relative bandwidth of 49%. Bandwidth can be controlled by properly adjusting the parameters of the design. The proposed design features a compact size and easy fabrication, due to the integration of SPP in a closed SIW.
AB - In this paper, spoof surface plasmon polariton (SSPPs) and substrate integrated waveguide (SIW) based bandpass filter is proposed. The metal strip on the top of the substrate is composed of periodic slots which supports surface wave mode of SPP within the closed substrate integrated waveguide. The dispersion relation of the proposed structure shows that it has both low-pass feature of SSP and the high-pass feature of SIW, and hence the combination of these two features leads to a bandpass filter (BPF). The results show that the passband is from 11.5-19 GHz with relative bandwidth of 49%. Bandwidth can be controlled by properly adjusting the parameters of the design. The proposed design features a compact size and easy fabrication, due to the integration of SPP in a closed SIW.
KW - bandpass filter
KW - spoof surface plasmon polariton (SSPPs)
KW - Substrate integrated waveguide (SIW)
UR - http://www.scopus.com/inward/record.url?scp=85050349248&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2017.8277014
DO - 10.1109/EDAPS.2017.8277014
M3 - Conference Proceeding
AN - SCOPUS:85050349248
T3 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
SP - 1
EP - 3
BT - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Y2 - 14 December 2017 through 16 December 2017
ER -