TY - JOUR
T1 - An unknown wafer surface defect detection approach based on Incremental Learning for reliability analysis
AU - Zhao, Zeyun
AU - Wang, Jia
AU - Tao, Qian
AU - Li, Andong
AU - Chen, Yiyang
N1 - Publisher Copyright:
© 2024 Elsevier Ltd
PY - 2024/4
Y1 - 2024/4
N2 - Wafer maps include information about multiple defect patterns on the wafer surface. Intelligent categorization of the defective wafer is essential for investigating the underlying causes and improving the reliability and safety of the entire system. Recently, convolutional neural networks (CNNs) have been widely employed to construct successful defect detectors by learning from offline defect datasets. However, traditional CNN-based detectors are costly and incapable of unknown production defect detection despite the accurate performance. In this paper, we propose a novel IL-based method, called PIRB, for online unknown wafer defect detection. Specifically, we leverage the neural networks to remember old defect patterns by selectively restricting learning on the important weights. A tiny reference buffer is applied to preserve the experienced wafer defect patterns in the learning process to facilitate the detection accuracy. The experimental results show that the proposed method works well for classifying unknown defects, with a 60% reduction in training time compared to offline learning and a 10% increase in total accuracy compared to the state-of-the-art methods.
AB - Wafer maps include information about multiple defect patterns on the wafer surface. Intelligent categorization of the defective wafer is essential for investigating the underlying causes and improving the reliability and safety of the entire system. Recently, convolutional neural networks (CNNs) have been widely employed to construct successful defect detectors by learning from offline defect datasets. However, traditional CNN-based detectors are costly and incapable of unknown production defect detection despite the accurate performance. In this paper, we propose a novel IL-based method, called PIRB, for online unknown wafer defect detection. Specifically, we leverage the neural networks to remember old defect patterns by selectively restricting learning on the important weights. A tiny reference buffer is applied to preserve the experienced wafer defect patterns in the learning process to facilitate the detection accuracy. The experimental results show that the proposed method works well for classifying unknown defects, with a 60% reduction in training time compared to offline learning and a 10% increase in total accuracy compared to the state-of-the-art methods.
KW - CNN
KW - Data augmentation
KW - Incremental learning
KW - Online learning
KW - Semiconductor manufacturing
KW - Unknown defect
KW - Wafer
UR - http://www.scopus.com/inward/record.url?scp=85183915994&partnerID=8YFLogxK
U2 - 10.1016/j.ress.2024.109966
DO - 10.1016/j.ress.2024.109966
M3 - Article
AN - SCOPUS:85183915994
SN - 0951-8320
VL - 244
JO - Reliability Engineering and System Safety
JF - Reliability Engineering and System Safety
M1 - 109966
ER -