Research and development of key technology of IC design module for embedded AI chip

  • Zhao, Chun (PI)
  • Yang, Li (Team member)
  • Liu, Wen (Team member)
  • Wen, Huiqing (Team member)
  • Qi, Yanfei (Team member)
  • 周德凡 (Team member)
  • 林永义 (Team member)
  • 刘启晗 (Team member)
  • 赵天石 (Team member)
  • 沈棕杰 (Team member)
  • 方欲晓 (Team member)
  • 李昂 (Team member)
  • 尹力 (Team member)
  • 耿显葳 (Team member)

Project: Internal Research Project

Project Details

Project Title (In Chinese)

面向嵌入式人工智能芯片集成电路设计模块关键技术的研究开发

Fund Amount (RMB)

1000000.00
Project CategoryKSF-Technology Transfer Programme
StatusFinished
Effective start/end date1/01/19 → 31/12/21

Fingerprint

Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
View full fingerprint