Selective SI:C epitaxy in recessed areas and characterization of the material properties

Yihwan Kim*, Zhiyuan Ye, Andrew Lam, Ali Zojaji, Yonah Cho, Satheesh Kuppurao

*Corresponding author for this work

Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

2 Citations (Scopus)

Abstract

Si:C epitaxy was investigated to increase the substitutional carbon concentration, to achieve selectivity, and to understand growth characteristics on different Si crystallographic planes. A defective microstructure was observed next to the recess sidewalls. It was found that Si:C epitaxial growth on (110) crystallographic plane is heavily defective while the same epitaxy on (100) plane shows defect-free microstructure. By process optimization and using the appropriate chemistries for deposition and etch steps, we have developed a selective Si:C epitaxy process which result in a defect-free epitaxial layer that fills a 60 nm deep recessed area with 1.5 % substitutional [C] with 100 % substitutionality, and 100 % selectivity on dielectrics. Also, thermal stability of the substitutional [C] in Si:C epitaxy was tested with spike annealing at 1050°C No loss of substitutional [C] was observed after the spike annealing from a Si:C film with 100 % carbon substitutionality.

Original languageEnglish
Title of host publicationECS Transactions - International Symposium on Advanced Gate Stack, Source/Drain and Channel Engineering for Si-based CMOS
Subtitle of host publicationNew Materials, Processes and Equipment, 3
PublisherElectrochemical Society Inc.
Pages409-417
Number of pages9
Edition1
ISBN (Electronic)9781566775502
ISBN (Print)9781566775502
DOIs
Publication statusPublished - 2007
Externally publishedYes
EventInternational Symposium on Advanced Gate Stack, Source/Drain and Channel Engineering for Si-based CMOS: New Materials, Processes and Equipment, 3 - 211th ECS Meeting - Chicago, IL, United States
Duration: 6 May 200710 May 2007

Publication series

NameECS Transactions
Number1
Volume6
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceInternational Symposium on Advanced Gate Stack, Source/Drain and Channel Engineering for Si-based CMOS: New Materials, Processes and Equipment, 3 - 211th ECS Meeting
Country/TerritoryUnited States
CityChicago, IL
Period6/05/0710/05/07

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