Abstract
We present here a low-temperature (Ts<630°C) process for the selective epitaxial growth of Si that employs atomic hydrogen. Modulation of both the substrate temperature and the flux of atomic hydrogen gives alternating growth and suppression/etching cycles, resulting in a significant increase in selectivity. Epitaxial thin-film quality is essentially unaffected, as verified by in situ analysis via low-energy electron diffraction, and ex situ analysis via scanning electron and atomic-force microscopy.
Original language | English |
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Pages (from-to) | 2181-2183 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 79 |
Issue number | 14 |
DOIs | |
Publication status | Published - 1 Oct 2001 |
Externally published | Yes |