Room temperature nanojoining of Cu-Ag core-shell nanoparticles and nanowires

Jiaqi Wang, Seungha Shin*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

26 Citations (Scopus)

Abstract

Room temperature (Troom, 300 K) nanojoining of Ag has been widely employed in fabrication of microelectronic applications where the shapes and structures of microelectronic components must be maintained. In this research, the joining processes of pure Ag nanoparticles (NPs), Cu-Ag core-shell NPs, and nanowires (NWs) are studied using molecular dynamics simulations at Troom. The evolution of densification, potential energy, and structural deformation during joining process are analyzed to identify joining mechanisms. Depending on geometry, different joining mechanisms including crystallization-amorphization, reorientation, Shockley partial dislocation are determined. A three-stage joining scenario is observed in both joining process of NPs and NWs. Besides, the Cu core does not participate in all joining processes, however, it enhances the mobility of Ag shell atoms, contributing to a higher densification and bonding strength at Troom, compared with pure Ag nanomaterials. The tensile test shows that the nanojoint bears higher rupture strength than the core-shell NW itself. This study deepens understanding in the underlying joining mechanisms and thus nanojoint with desirable thermal, electrical, and mechanical properties could be potentially achieved.

Original languageEnglish
Article number53
JournalJournal of Nanoparticle Research
Volume19
Issue number2
DOIs
Publication statusPublished - 1 Feb 2017
Externally publishedYes

Keywords

  • Core-shell
  • Cu-Ag
  • Modeling and simulation
  • Molecular dynamics
  • Nanocomposites
  • Nanojoining
  • Nanoparticles
  • Nanowires

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