In-situ study of creep in Sn-3Ag-0.5Cu solder

Tianhong Gu*, Vivian S. Tong, Christopher M. Gourlay, T. Ben Britton

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)

Abstract

The creep behaviour and microstructural evolution of a Sn-3Ag-0.5Cu wt% sample with a columnar microstructure have been investigated through in-situ creep testing under constant stress of 30 MPa at ~298 K. This is important, as 298 K is high temperature within the solder system and in-situ observations of microstructure evolution confirm the mechanisms involved in deformation and ultimately failure of the material. The sample has been observed in-situ using repeat and automatic forescatter diode and auto electron backscatter diffraction imaging. During deformation, polygonisation and recrystallisation are observed heterogeneously with increasing strain, and these correlate with local lattice rotations near matrix-intermetallic compound interfaces. Recrystallised grains have either twin or special boundary relationships to their parent grains. The combination of these two imaging methods reveal grain 1 (loading direction, LD, 10.4° from [100]) deforms less than the neighbour grain 2 (LD 18.8° from [110]), with slip traces in the strain localised regions. In grain 2, (11¯0)[001] slip system is observed and in grain 1 (11¯0)[1¯1¯1]/2 and (110)[1¯11]/2 slip systems are observed. Lattice orientation gradients build up with increasing plastic strain and near fracture recrystallisation is observed concurrent with fracture.

Original languageEnglish
Pages (from-to)31-43
Number of pages13
JournalActa Materialia
Volume196
DOIs
Publication statusPublished - 1 Sept 2020
Externally publishedYes

Keywords

  • Creep
  • In-situ EBSD
  • Pb-free solder
  • Recrystallisation and Microstructure evolution

Fingerprint

Dive into the research topics of 'In-situ study of creep in Sn-3Ag-0.5Cu solder'. Together they form a unique fingerprint.

Cite this