Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder

Tianhong Gu*, Christopher M. Gourlay, T. Ben Britton

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


The reliability of solder joints is affected significantly by thermomechanical properties such as creep and thermal fatigue. In this work, the creep of directionally solidified (DS) Sn-3Ag-0.5Cu wt.% (SAC305) dog-bone samples (gauge dimension: 10 × 2 × 1.5 mm) with a controlled <110> or <100> fibre texture is investigated under constant load testing (stress level: ∼ 30 MPa) at a range of temperatures from 20°C to 200°C. Tensile testing is performed and the secondary creep strain rate and the localised strain gradient are studied by two-dimensional optical digital image correlation (2-D DIC). The dominating creep mechanisms and their temperature dependence are explored at the microstructural scale using electron backscatter diffraction (EBSD), which enables the understanding of the microstructural heterogeneity of creep mechanisms at different strain levels, temperatures and strain rates. Formation of subgrains and the development of recrystallization are observed with increasing strain levels. Differences in the deformation of β-Sn in dendrites and in the eutectic regions containing Ag3Sn and Cu6Sn5 are studied and related to changes in local deformation mechanisms.

Original languageEnglish
Pages (from-to)107-121
Number of pages15
JournalJournal of Electronic Materials
Issue number1
Publication statusPublished - 15 Jan 2019
Externally publishedYes


  • creep
  • microstructure evolution
  • Pb-free solder
  • recrystallization


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