Electrical Performance Analysis of AlGaN/GaN Fin-HEMTs with Different Gate Structures by TCAD Simulation

Zifeng Qu*, Yizhou Jiang, Yichi Zhang, Huiqing Wen

*Corresponding author for this work

Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

Abstract

In this paper, AlGaN/GaN fin-shaped high-electron mobility transistors (Fin-HEMTs) with different gate structures are simulated in 3-D TCAD. By comparing the transfer and transconductance curves and observing the two-dimensional electron gas (2-DEG) distribution underneath the gate, the effect of gate variations on the threshold voltage of AlGaN/GaN Fin-HEMTs is investigated in three dimensions: width, height, and length. The results show that Fin devices have better gate control compared to planar devices and that the threshold voltage of Fin devices is inversely proportional to the width of the gate and, conversely, proportional to the height and length of the gate, which provides a reference for miniaturized device design.

Original languageEnglish
Title of host publication2023 20th China International Forum on Solid State Lighting and 2023 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA
Subtitle of host publicationIFWS 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages183-186
Number of pages4
ISBN (Electronic)9798350385373
DOIs
Publication statusPublished - 2023
Event20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023 - Xiamen, Fujian, China
Duration: 27 Nov 202330 Nov 2023

Publication series

Name2023 20th China International Forum on Solid State Lighting and 2023 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023

Conference

Conference20th China International Forum on Solid State Lighting and 9th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2023
Country/TerritoryChina
CityXiamen, Fujian
Period27/11/2330/11/23

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