TY - JOUR
T1 - Easy and large scale synthesis silver nanodendrites
T2 - Highly effective filler for isotropic conductive adhesives
AU - Dai, Kai
AU - Zhu, Guangping
AU - Lu, Luhua
AU - Dawson, Graham
PY - 2012/3
Y1 - 2012/3
N2 - Dendritic silver (Ag) nanoparticles have been successfully prepared by an easy and large scale liquid-phase reduction method. Transmission electron microscope (TEM), scanning electron microscope (SEM), and x-ray diffraction (XRD) have shown that the Ag particles prepared by this method are pure and with uniform dendritic morphology. The bulk resistivity and bonding strength of isotropic conductive adhesives (ICAs) filled with Ag nanodendrite and micrometer-sized Ag have been measured. The results show that the dendritic morphology of Ag nanoparticles has a strong effect for improving the reinforcement of the composite electrical performance. ICA filled with small amounts of Ag nanodendrites exhibits lower bulk resistivity and higher bonding strength than ICA filled with micrometer-sized Ag. When ICA is filled with 50 wt.% micrometer-sized Ag and 10 wt.% Ag nanodendrites, the bulk resistivity is 1.3×10 -4 Ω cm, and the bonding strength reaches 18.9 MPa.
AB - Dendritic silver (Ag) nanoparticles have been successfully prepared by an easy and large scale liquid-phase reduction method. Transmission electron microscope (TEM), scanning electron microscope (SEM), and x-ray diffraction (XRD) have shown that the Ag particles prepared by this method are pure and with uniform dendritic morphology. The bulk resistivity and bonding strength of isotropic conductive adhesives (ICAs) filled with Ag nanodendrite and micrometer-sized Ag have been measured. The results show that the dendritic morphology of Ag nanoparticles has a strong effect for improving the reinforcement of the composite electrical performance. ICA filled with small amounts of Ag nanodendrites exhibits lower bulk resistivity and higher bonding strength than ICA filled with micrometer-sized Ag. When ICA is filled with 50 wt.% micrometer-sized Ag and 10 wt.% Ag nanodendrites, the bulk resistivity is 1.3×10 -4 Ω cm, and the bonding strength reaches 18.9 MPa.
KW - Bonding strength
KW - Bulk resistivity
KW - Conductive adhesive
KW - Silver nanodendrite
UR - http://www.scopus.com/inward/record.url?scp=84862220799&partnerID=8YFLogxK
U2 - 10.1007/s11665-011-9918-z
DO - 10.1007/s11665-011-9918-z
M3 - Article
AN - SCOPUS:84862220799
SN - 1059-9495
VL - 21
SP - 353
EP - 357
JO - Journal of Materials Engineering and Performance
JF - Journal of Materials Engineering and Performance
IS - 3
ER -