International Innovation Research Institute of Third Generation Semiconductor Power Electronic Devices and Power Integration

Wen, Huiqing (PI)
Liu, Wen (Team member)
Lim, Eng Gee (Team member)
Yue, Yong (Team member)
Wang, Xinheng (Team member)
Ma, Fei (Team member)
Xu, Dechang (Team member)
Yang, Li (Team member)
Wang, Ruiyao (Team member)
Sun, Jie (Team member)
Xue, Fei (Team member)
Chen, Min (Team member)
Wang, Zhao (Team member)
Yu, Limin (Team member)
Zhao, Chun (Team member)
Liu, Yina (Team member)
Song, Pengfei (Team member)
Zhao, Yinchao (Team member)
Cui, Miao (Team member)
Ma, Jieming (Team member)
Liu, Chenguang (Team member)
Qi, Yanfei (Team member)
R., Paul (Team member)
Taylor, Steve (Team member)
Nichols, Richard (Team member)
C., Yung (Team member)
Spencer, Joseph (Team member)
Smith, Jeremy (Team member)
Qian, Hongtu (Team member)
Zhao, Shufeng (Team member)

Project: Governmental Research Project

Project Title (In Chinese)

第三代半导体电力电子器件与功率集成国际创新研究院

Fund Amount (RMB)

4200000.00

Project Category	SIP Construction of High-quality Innovation Platform: Major Platform-New Construction
Status	Finished
Effective start/end date	1/01/22 → 31/12/24