HapticBox: Designing Hand-Held Thermal, Wetness, and Wind Stimuli for Virtual Reality

  • Kedong Chai (Speaker)
  • Li, Y. (Speaker)

Activity: Talk or presentationPresentation at conference/workshop/seminar

PeriodMar 2023
Event title30th IEEE Conference Virtual Reality and 3D User Interfaces, VR 2023
Event typeConference
SponsorsBaidu, et al, Lujiazui Financial City, Sensetime, Unity China, Ximmerse
LocationVirtual, Online, ChinaShow on map
Degree of RecognitionInternational