Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders

^*Corresponding author for this work

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11 Citations (Scopus)

Original language	English
Journal	Materials Science and Engineering A
Volume	918
Issue number	147429
DOIs	https://doi.org/10.1016/j.msea.2024.147429
Publication status	Published - Dec 2024

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title = "Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders",

author = "Tianhong Gu and Yilun Xu and Gourlay, \{Christopher M.\} and Dunne, \{Fionn P.E.\} and \{Ben Britton\}, T.",

year = "2024",

month = dec,

doi = "10.1016/j.msea.2024.147429",

language = "English",

volume = "918",

journal = "Materials Science and Engineering A",

issn = "0921-5093",

number = "147429",

}

TY - JOUR

T1 - Understanding the deformation creep and role of intermetallic compound-microstructure in Sn-Ag-Cu solders

AU - Gu, Tianhong

AU - Xu, Yilun

AU - Gourlay, Christopher M.

AU - Dunne, Fionn P.E.

AU - Ben Britton, T.

PY - 2024/12

Y1 - 2024/12

U2 - 10.1016/j.msea.2024.147429

DO - 10.1016/j.msea.2024.147429

M3 - Article

SN - 0921-5093

VL - 918

JO - Materials Science and Engineering A

JF - Materials Science and Engineering A

IS - 147429

ER -