Abstract
A record-low Ohmic contact resistance is obtained on p++-GaN/p-GaN/GaN/AlGaN/GaN epitaxial structure designed for GaN CMOS circuit. Ni/Ag/NiO (1/120/6 nm) after 500 °C/360 s annealing in air atmosphere demonstrates an ultralow contact resistance (1.67 Ω mm) and the lowest specific contact resistivity (6.48 × 10-7 Ω cm2) reported so far. The employment of a NiO capping layer on Ni/Ag metal stack has improved the annealing thermal stability and electrical properties.
| Original language | English |
|---|---|
| Article number | 083505 |
| Journal | Applied Physics Letters |
| Volume | 127 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 25 Aug 2025 |
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