Ultralow-Ohmic-contact resistance of Ni/Ag/NiO on p++-GaN/p-GaN/AlGaN/GaN platform

  • Zhiwei Sun
  • , Tianyu Zhao
  • , Maoqing Ling
  • , Jingang Li
  • , Hao Tian
  • , Weisheng Wang
  • , Yuanlei Zhang
  • , Jie Zhang
  • , Yinchao Zhao
  • , Ivona Z. Mitrovic
  • , Harm van Zalinge
  • , Kain Lu Low
  • , Sen Huang
  • , Wen Liu*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

A record-low Ohmic contact resistance is obtained on p++-GaN/p-GaN/GaN/AlGaN/GaN epitaxial structure designed for GaN CMOS circuit. Ni/Ag/NiO (1/120/6 nm) after 500 °C/360 s annealing in air atmosphere demonstrates an ultralow contact resistance (1.67 Ω mm) and the lowest specific contact resistivity (6.48 × 10-7 Ω cm2) reported so far. The employment of a NiO capping layer on Ni/Ag metal stack has improved the annealing thermal stability and electrical properties.

Original languageEnglish
Article number083505
JournalApplied Physics Letters
Volume127
Issue number8
DOIs
Publication statusPublished - 25 Aug 2025

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