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Towards direct band-to-band tunneling in P-channel tunneling field effect transistor (TFET): Technology enablement by Germanium-tin (GeSn)

  • Yue Yang*
  • , Shaojian Su
  • , Pengfei Guo
  • , Wei Wang
  • , Xiao Gong
  • , Lanxiang Wang
  • , Kain Lu Low
  • , Guangze Zhang
  • , Chunlai Xue
  • , Buwen Cheng
  • , Genquan Han
  • , Yee Chia Yeo
  • *Corresponding author for this work
  • National University of Singapore
  • CAS - Institute of Semiconductors

Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

46 Citations (Scopus)

Abstract

Tunneling field-effect transistor (TFET) could achieve sub-60 mV/decade subthreshold swing S at room temperature and could enable ultra-low supply voltage VDD and power consumption. Drive current above 100 μA/μm was achieved in III-V-based n-channel TFETs (nTFETs), due to the direct BTBT and high electron mobility in III-V materials [1-2]. However, more research is needed for p-channel TFET (pTFET). While III-V materials have high direct band-to-band tunneling (BTBT) rate, hole mobilities are generally low and lead to high channel resistance [Fig. 1(b)]. SiGe or Ge have high hole mobility and might be promising for pTFETs, but the the BTBT is indirect and the on-state current is low. Also, high activation temperature and large diffusivity of n-type dopants in Ge make it very difficult to form good N+/P junction in Ge.

Original languageEnglish
Title of host publication2012 IEEE International Electron Devices Meeting, IEDM 2012
Pages16.3.1-16.3.4
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 IEEE International Electron Devices Meeting, IEDM 2012 - San Francisco, CA, United States
Duration: 10 Dec 201213 Dec 2012

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Conference

Conference2012 IEEE International Electron Devices Meeting, IEDM 2012
Country/TerritoryUnited States
CitySan Francisco, CA
Period10/12/1213/12/12

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