Topology Optimization of Manifold Microchannel Heat Sink for Multichip Power Modules

The high power density and high integration of power electronics impose greater demands on cooling systems. Inefficient cooling can lead to overheating failure, performance degradation, and shortened life. In this study, a multi-objective topology optimization (TO) is utilized to optimize the manifold heat sink for multichip power modules (MCPMs). The non-uniform temperature distribution obtained from thermal analysis is used as the accurate loading constraint for topological fin design. The optimized designs are compared with the conventional parallel fins and pin fins through numerical simulation analysis. The results indicate that the conventional parallel fins and pin fins show higher chip temperature, while topological fins maintain significantly lower chip temperature. Topological fins using a non-uniform heat source achieve the best heat dissipation, reducing chip temperatures by 5 ℃ compared to pin fins and nearly 10 ℃ compared to parallel fins. Additionally, the minimum temperature deviation between the chips demonstrates high temperature uniformity. Topology optimization enhances the heat dissipation capability of manifold heat sinks with a moderate increase in pressure drop. Considering the real, accurate non-uniform heat sources can achieve better overall performance.