Skip to main navigation Skip to search Skip to main content

Tiled and layer-adaptive three-dimensional structured illumination microscopy based on principal component analysis

  • Weiyi Xia*
  • , Jiaming Qian
  • , Pengfei Fan
  • , Chao Zuo
  • *Corresponding author for this work
    • Nanjing University of Science and Technology
    • Jiangsu Key Laboratory of Spectral Imaging & Intelligent Sense

    Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

    Abstract

    Three-dimensional (3D) Structured illumination microscopy (SIM) has become one of the most commonly implemented fluorescence super-resolution modes in life sciences due to its unique advantages of wide field of view, fast imaging, and weak phototoxicity and photobleaching. However, the traditional two-dimensional (2D) SIM suffers from the”missing cone” problem, which makes it impossible to realize true three-dimensional (3D) imaging. In order to solve this problem, 3D SIM has been developed to achieve twice the resolution in both lateral and axial directions. Recently, we propose a tiled and layer-adaptive 3D SIM based on principal component analysis (PCA) to solve the computational complexity and time-consuming, local perturbation of illumination parameters, and microscope moving mechanical errors faced by 3D SIM in parameter estimation. The algorithm accelerates and improves the accuracy of transverse and axial illumination parameters, which is expected to achieve fast, iteration-free, high-precision, high-quality 3D SIM super-resolution imaging.

    Original languageEnglish
    Title of host publicationSixth Conference on Frontiers in Optical Imaging and Technology
    Subtitle of host publicationNovel Imaging Systems
    EditorsYan Zhou, Qiang Zhang, Feihu Xu, Bo Liu
    PublisherSPIE
    ISBN (Electronic)9781510679702
    DOIs
    Publication statusPublished - 2024
    Event6th Conference on Frontiers in Optical Imaging and Technology: Novel Imaging Systems - Nanjing, China
    Duration: 22 Oct 202324 Oct 2023

    Publication series

    NameProceedings of SPIE - The International Society for Optical Engineering
    Volume13155
    ISSN (Print)0277-786X
    ISSN (Electronic)1996-756X

    Conference

    Conference6th Conference on Frontiers in Optical Imaging and Technology: Novel Imaging Systems
    Country/TerritoryChina
    CityNanjing
    Period22/10/2324/10/23

    Keywords

    • 3D SIM
    • layer-adaptive
    • parameter estimation
    • principal component analysis
    • tiled reconstruction

    Fingerprint

    Dive into the research topics of 'Tiled and layer-adaptive three-dimensional structured illumination microscopy based on principal component analysis'. Together they form a unique fingerprint.

    Cite this