Substrate Coupling in SOI Technology: An Electromagnetic Study for RF Integrated Circuit Design & Manufacturing

^*Corresponding author for this work

Research output: Contribution to conference › Paper › peer-review

2 Citations (Scopus)

Original language	English
DOIs	https://doi.org/10.1109/ICICDT63592.2024.10717649
Publication status	Published - 25 Sept 2024
Event	The 21st International Conference on IC Design and Technology - Singapore, Singapore Duration: 26 Sept 2024 → 28 Sept 2024 https://icicdt2024.org/

Conference	The 21st International Conference on IC Design and Technology
Abbreviated title	ICICDT 2024
Country/Territory	Singapore
City	Singapore
Period	26/09/24 → 28/09/24
Internet address	https://icicdt2024.org/

Access to Document

@conference{732af3dd3ae9498db1025b3ce46b5442,

title = "Substrate Coupling in SOI Technology: An Electromagnetic Study for RF Integrated Circuit Design \& Manufacturing",

author = "Rui Yao and Zhao Wang and Sang Lam and Steve Taylor",

year = "2024",

month = sep,

day = "25",

doi = "10.1109/ICICDT63592.2024.10717649",

language = "English",

note = "The 21st International Conference on IC Design and Technology, ICICDT 2024 ; Conference date: 26-09-2024 Through 28-09-2024",

url = "https://icicdt2024.org/",

}

TY - CONF

T1 - Substrate Coupling in SOI Technology: An Electromagnetic Study for RF Integrated Circuit Design & Manufacturing

AU - Yao, Rui

AU - Wang, Zhao

AU - Lam, Sang

AU - Taylor, Steve

PY - 2024/9/25

Y1 - 2024/9/25

U2 - 10.1109/ICICDT63592.2024.10717649

DO - 10.1109/ICICDT63592.2024.10717649

M3 - Paper

T2 - The 21st International Conference on IC Design and Technology

Y2 - 26 September 2024 through 28 September 2024

ER -