Reliability Analysis of Cyclic Accelerated Life Test Data Using Log-Location-Scale Family of Distributions Under Censoring With Application to Solder Joint Data

Wenhan Zhang; Xiaojun Zhu; Mu He; Narayanaswamy Balakrishnan

Reliability Analysis of Cyclic Accelerated Life Test Data Using Log-Location-Scale Family of Distributions Under Censoring With Application to Solder Joint Data

Wenhan Zhang, Xiaojun Zhu^*, Mu He, Narayanaswamy Balakrishnan

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Original language	English
Journal	IEEE Transactions on Reliability
Publication status	Published - Dec 2024

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https://ieeexplore.ieee.org/document/10806665

Cite this

@article{55c4d8b810f8432db22e4184ac0afa53,

title = "Reliability Analysis of Cyclic Accelerated Life Test Data Using Log-Location-Scale Family of Distributions Under Censoring With Application to Solder Joint Data",

author = "Wenhan Zhang and Xiaojun Zhu and Mu He and Narayanaswamy Balakrishnan",

year = "2024",

month = dec,

language = "English",

journal = "IEEE Transactions on Reliability",

issn = "0018-9529",

}

TY - JOUR

T1 - Reliability Analysis of Cyclic Accelerated Life Test Data Using Log-Location-Scale Family of Distributions Under Censoring With Application to Solder Joint Data

AU - Zhang, Wenhan

AU - Zhu, Xiaojun

AU - He, Mu

AU - Balakrishnan, Narayanaswamy

PY - 2024/12

Y1 - 2024/12

M3 - Article

SN - 0018-9529

JO - IEEE Transactions on Reliability

JF - IEEE Transactions on Reliability

ER -