Plasma-Enhanced Combustion-Processed Al Gate Oxide for in Thin Film Transistors

  • Q. H. Liu
  • , C. Zhao
  • , C. Z. Zhao
  • , I. Z. Mitrovic
  • , S. Hall
  • , W. Y. Xu
  • , L. Yang
  • , E. G. Lim
  • , Q. N. Wang
  • , Y. L. Wei
  • , Y. X. Cao

Research output: Chapter in Book or Report/Conference proceedingConference Proceedingpeer-review

Abstract

In this study, we describe how to obtain high-quality Al dielectric thin films and their implementation in In thin film transistors by combining plasma treatment and combustion process at low temperatures (250 °C). The single layer Al dielectric formed by this technique exhibited a higher areal capacitance and a lower leakage level compared with those of conventional solution-processed Al. The resulting TFTs presented a superior electrical performance at a low operating voltage of 2 V, with a positive threshold voltage of 0.39 V, a subthreshold swing of 0.V/decade, an On/Off ratio of 1.8×104, and a superior mobility of 136 cm2 V-1 s-1.

Original languageEnglish
Title of host publication17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728118536
DOIs
Publication statusPublished - Jun 2019
Event17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Suzhou, China
Duration: 17 Jun 201919 Jun 2019

Publication series

Name17th IEEE International Conference on IC Design and Technology, ICICDT 2019 - Proceedings

Conference

Conference17th IEEE International Conference on IC Design and Technology, ICICDT 2019
Country/TerritoryChina
CitySuzhou
Period17/06/1919/06/19

Keywords

  • Low-temperature
  • Solution-processed
  • combustion synthesis
  • environmentally friendly
  • metal oxide thin-film transistors

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