TY - GEN
T1 - Numerical Simulation of Piezoelectric Corrugated Sandwich Structures Filled with Viscoelastic Material
AU - Xing, Yuxuan
AU - Wang, Xiang
AU - Chen, Min
AU - Zhang, Shunqi
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - The single-function corrugated sandwich structures are difficult to meet the requirements of aerospace and automobile industries for strong vibration isolation and high damping. Meanwhile, the complexity of corrugated structures will take up massive computing time and waste computing resources in the simulation. Here a sandwich laminated structure is proposed with enhanced damping characteristics through the filling of viscoelastic material into the corrugated layer. With the consideration of periodic boundary conditions (PBCs), three dimensions (3D) homogenized method is adopted to link the representative volume element (RVE) to the global structure. The results indicate that the homogenized model can replace the corrugated model and save computing time and resources significantly.
AB - The single-function corrugated sandwich structures are difficult to meet the requirements of aerospace and automobile industries for strong vibration isolation and high damping. Meanwhile, the complexity of corrugated structures will take up massive computing time and waste computing resources in the simulation. Here a sandwich laminated structure is proposed with enhanced damping characteristics through the filling of viscoelastic material into the corrugated layer. With the consideration of periodic boundary conditions (PBCs), three dimensions (3D) homogenized method is adopted to link the representative volume element (RVE) to the global structure. The results indicate that the homogenized model can replace the corrugated model and save computing time and resources significantly.
KW - Corrugated sandwich structures
KW - Homogenized modeling
KW - Piezoelectric structures
KW - Viscoelastic structures
UR - https://www.scopus.com/pages/publications/85149439690
U2 - 10.1109/SPAWDA56268.2022.10046029
DO - 10.1109/SPAWDA56268.2022.10046029
M3 - Conference Proceeding
AN - SCOPUS:85149439690
T3 - Proceedings of the 2022 16th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications, SPAWDA 2022
SP - 306
EP - 309
BT - Proceedings of the 2022 16th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications, SPAWDA 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications, SPAWDA 2022
Y2 - 10 October 2022 through 14 October 2022
ER -