Multi-objective optimization of a bionic microchannel heat sink based on Fibonacci spiral for electronic components

The dramatically increasing power density and integration of modern electronic systems place progressively higher demands on advanced thermal management solutions to mitigate overheating risks. This paper proposes a bionic microchannel heat sink inspired by Fibonacci spiral geometries observed in nature. By integrating response surface methodology with multi-objective genetic algorithm optimization, we systematically quantified the parametric influences, identifying channel width as the dominant factor affecting thermal-hydraulic performance, followed by spiral radius and channel count. In a water-cooling application for a 1 kW heat source with a heating area of 55 mm × 55 mm, a comparative analysis with advanced designs: the uniform pin fin pattern, phyllotactic pin fin pattern, and the topology optimized pattern reveal that the Fibonacci spiral channel provides the best overall performance, with an improvement of at least 6.1 % in relative performance evaluation criteria. At a flow rate of 1 L/min, the optimized design demonstrates 8.8 % reduction in the maximum temperature and 34.6 % improvement in temperature uniformity compared to conventional uniform pin fin channel, achieving these enhancements with only a 16.3 % increase in pressure drop. Overall, this work establishes a nature-inspired design approach, offering actionable guidelines for developing high-performance thermal management systems for high power electronics.